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Solder paste for reflow full#
Solder paste for reflow series#

Flux Gel: OM-338 Flux Gel is available in 10cc and 30cc syringes for rework applications. Powder Size: Type 3, (25-45μm per IPC J-STD-005) and Type 4 (20-38μm per IPC J-STD-005) – Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow TM cassettes, and 10cc and 30cc dispense syringes.

Compatible with either nitrogen or air reflow PRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC387 (95.5%Sn/3.8%Ag/0.7%Cu) SAC396 (95.5%Sn/3.9%Ag/0.6%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACXTM e1 alloys per JESD97 Classification For other alloys, contact your local Cookson Electronics Sales Office.

Excellent reliability properties, halide-free material.

Meets highest IPC 7095 voiding performance classification of Class III.

Reduction in random solderballing levels, minimizing rework and increasing first time yield.

Excellent solder and flux cosmetics after reflow soldering.

Wide reflow profile window with good solderability on various board / component finishes.

Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.

Excellent print consistency with high process capability index across all board designs.

Solder paste for reflow full#

Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. ALPHA OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste.

Solder paste for reflow series#

ALPHA® OM-338 Series ULTRA FINE FEATURE LEAD-FREE SOLDER PASTE DESCRIPTION ALPHA OM-338 is a lead-free, no-clean solder paste designed for a broad range of applications.